RX50M Research-Grade Metallurgical Microscope｜High-Resolution, Industrial-Class Inspection Solution
The all-new RX50M research-grade metallurgical microscope integrates multiple internationally advanced technologies. From optical architecture and imaging performance to user operation, every aspect has been comprehensively upgraded to deliver a highly reliable professional solution for industrial inspection, materials analysis, semiconductor manufacturing, and academic research.
Key Features
- Wide-Beam Optical Imaging System: Supports an ultra-wide 25 mm field of view, providing a larger and clearer image area to enhance inspection efficiency and viewing comfort.
- Advanced Polarization System: Equipped with polarizer and analyzer slots to effectively suppress stray light, ideal for stress and surface structure observation of semiconductor wafers, PCBs, and metallic materials. The 360° rotatable analyzer allows polarization angle adjustment without repositioning the sample.
- Differential Interference Contrast (DIC): Converts subtle height variations into high-contrast, three-dimensional images, suitable for inspecting fine structures such as LCD conductive particles and micro-scratches on precision disks.
- Linked Brightfield/Darkfield Switching: Neutral density filters are synchronized with the switching lever to reduce sudden light intensity when changing from darkfield to brightfield, improving user safety and visual comfort.
- Multi-Position Objective Turret: Supports multiple objective configurations, enabling continuous observation from low to high magnification at the same location—ideal for materials and microstructure analysis.
- Right-Hand Large-Travel Mechanical Stage: A 4-inch large-area stage with Y-axis locking function prevents positional shifts during array inspections, reducing missed areas and improving accuracy.
- Transmitted & Reflected Illumination System: Utilizes a 12V 100W Philips 7724 halogen lamp to deliver high-brightness, uniform illumination compatible with various optical observation modes.
- Multiple Observation Modes: Reflected brightfield, reflected darkfield, transmitted brightfield, polarization, and reflected DIC modes to meet diverse inspection requirements.
- Flexible Imaging System Options: Compatible with 4K HDMI, USB 3.0, extended depth-of-field fusion, measurement and analysis software, and metallographic analysis systems.