Thermal Conductivity and Thermal Diffusivity Instruments

Thermal Conductivity / Thermal Diffusivity Analyzers｜Solutions for Thermal Conductivity, Thermal Diffusivity, and Specific Heat Measurement

Thermal Conductivity / Thermal Diffusivity Analyzers provide accurate measurement of thermal conductivity, thermal diffusivity, and specific heat capacity, delivering comprehensive thermal property information on a material’s ability to store and transfer heat. These systems are widely used in applications such as electronic thermal management design, building insulation materials, thermal interface materials (TIM), ceramics, metals, and composite materials.

Why Is Thermal Conductivity Measurement Critical?

Thermal conductivity represents a material’s ability to transfer heat from one side to another and is a key parameter in thermal management and material design. Whether in electronic device cooling design, thermal insulation performance evaluation of building materials, heat transfer efficiency of thermal interface materials (TIM), or high-temperature applications of ceramics, metals, and composite materials, accurate understanding of heat conduction behavior helps to:

• Optimize product structural design and ensure thermal stress safety.
• Evaluate material heat resistance and thermal efficiency to select suitable material combinations.
• Improve process conditions and energy efficiency, reducing overall energy consumption.
• Enhance thermal management strategies to extend product lifetime and operational stability.

Through precise thermal conductivity and thermal diffusivity measurements, thermal property models can be established under different temperatures and boundary conditions, providing reliable data for new material development, quality control, and thermal simulation modeling.

Standards Compliance

The measurement methods comply with multiple international standards for thermal property characterization, supporting validation requirements across different materials and application scenarios, including:

JIS A 1412, ASTM E 1461, DIN 30905, DIN EN 821, ASTM C 714,
BS EN 1159-2, DIN EN 12667, ISO 8301, ASTM C 518, ASTM D 5470

Instrument Models and Measurement Technologies

TIM-TESTER｜Thermal Resistance and Thermal Conductivity Measurement for TIM

Specifically designed for thermal interface materials (TIM), the system measures thermal resistance and effective thermal conductivity in accordance with relevant standards, simulating actual clamping pressure and operating temperature conditions.

• Temperature range: Ambient to 150°C / -30°C to +150°C / Ambient to 300°C.
• Cooling options: Integrated cooling unit, external cooling unit (can be combined with an additional heater).

LFA 500｜Light Flash Analyzer

Using the Light / Laser Flash Method to measure thermal diffusivity and combining the results with density and specific heat to calculate thermal conductivity, this robust system is a workhorse model suitable for routine R&D and quality control measurements.

• Temperature range: -50 to 500°C / Ambient to 1250 / 1600 / 2000 / 2800°C.

LFA 1000 & LFA 2000｜Advanced Laser Flash Thermal Conductivity Analyzers

The high-end LFA series employs a true laser source, making it suitable for research-grade applications requiring high sensitivity and repeatability. Various furnace and sample holder configurations are available to build a complete thermal property measurement platform.

• Temperature range: -125 / -100 to 500°C.
• High-temperature modules: Ambient to 1250 / 1600 / 2000 / 2800°C (depending on furnace configuration).

TF-LFA｜Thin Film Thermal Conductivity Measurement (TDTR)

Based on Time-Domain Thermoreflectance (TDTR) technology, this system is designed for nano-scale thin films, functional coatings, interface layers, and semiconductor packaging materials. It enables measurement of:

• Thermal conductivity of thin films and interfacial thermal resistance.
• Thermal transport behavior of multilayer structures or anisotropic materials.

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