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2025 Advanced Ceramics Technology Forum

2025 Advanced Ceramics Technology Forum

 

With the rapid development of technologies such as artificial intelligence, green energy, and high-speed wireless communications, electronic products are no longer only required to be lightweight, thin, short, and compact. The introduction of high-performance computing and cloud computing has further accelerated the growth of the semiconductor industry. As a result, semiconductor technologies and their application nodes pose significant challenges to the development of semiconductor materials, packaging technologies, and related passive components.

Accordingly, driven by technological advancement, certain ceramic materials and their processing technologies have been observed to play a critical role in advanced semiconductors, packaging, and passive components.

This forum, titled “Advanced Ceramics Materials Technology Forum – Semiconductors, Packaging, and Passive Components,” is jointly organized by the Industrial Technology Research Institute (ITRI), National Taipei University of Technology (NTUT), the Taiwan Ceramic Society (TCERS), and the Taiwan Passive Components Industry Association (TPCIA). Through this forum, domestic and international researchers in the field of ceramic science are invited to conduct in-depth analysis, research, and discussion on key issues related to advanced semiconductor technologies.

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